HGX-160 plus molding encapsulants 
 ● Product characteristics: 
 Plus · 160 pairs of component silicone molding encapsulants, general-purpose, low viscosity, easy to operate; 
 · Rubber mixed with longer storage time at room temperature, but in Canada 
 Hot conditions, fast-curing, especially in favor of automatic production line to make 
 Use; 
 Temperature resistance, high temperature aging. After curing in a wide temperature range (-60 ~ 250 ℃) to maintain elasticity, excellent insulating properties; 
 · Thermal conductivity and excellent flame retardant properties; 
 · The process of curing shrinkage, better waterproof moisture-proof and anti-aging properties. 

 ● Typical use: 
 · For high-power electronic components, heat and temperature requirements of the module power supply and circuit board potting protection. Module power LED high power lamp and automotive HID lamp module power supply, automotive ignition systems, network transformers. 

 ● Use the process: 
 By the ratio of weighing the two components into a mixing tank, mixing evenly. 
 The mixed rubber perfusion within the device to be potting, generally from time to vacuum deaeration, For high thermal conductivity, it is recommended that the vacuum deaeration followed by reperfusion. Room temperature or heat curing can be. Curing speed curing temperature in the winter to take a very long time to cure, it is recommended that the heating methods curing and cured for 15-30 minutes, 80 ℃, room temperature curing normally takes about five hours. 

 ● Note: 
 · Plastic material should be sealed. A good mix rubber should be run out of time to avoid wastage. 
 ? This product is a non-dangerous goods, but not to the entrance and eye. 
 · A long time after the deposit of fill will be in the plastic settlement. Please stir well before use, without compromising performance. 
 · Glue contact with a certain amount of the following chemicals to make 160 not curing (trace amounts of the following substances will not affect the cure): 
 · N, P and S compounds. 
 · Sn, Pb, Hg, As and other elements in ionic compounds. 
 Containing alkynes and vinyl compounds. 
 In order to avoid the above phenomenon, so the use of the circuit board as far as possible wipe clean above residues of rosin to make use of low lead content of solder. 

 Technical parameters: 
 Before mixing properties (25 ° C, 65% RH) 
 Components of 160 A, 160 B 
 Color Black white fluid fluid 
 Viscosity (cP) 2000 3000 1500 2500 
 The proportion of 1.40-1.50 1.40-1.50 
 Mixing properties (25 ℃, 65% RH) 
 Mixing ratio (weight ratio) A: B = 1: 1 
 Color gray and black 
 Mixture viscosity (CP) 1500 ~~ 2500 
 Operating time (25 ℃, min) of 75 ~~ 105 
 Curing time (25 ℃, h) 24 
 Curing time (min, 80 ℃) 15 ~ 30 
 Curing 7 d, 25 ℃, 65% RH 
 Hardness (shore A) 35-45 
 Thermal conductivity [W (m · K)] ≥ 0.8 
 Dielectric Strength (kV / mm) ≥ 27 
 Dielectric constant (1.2MHz) 3.0 ~~ 3.3 
 Volume resistivity (Ω · cm) ≥ 1.0 × 1016 
 Coefficient of linear expansion [m / (m · K)] ≤ 2.2 × 10-4 
 * Viscosity, color, curing time according to user requests to adjust 

 ● Package Specifications: 
 · 20Kg / sets.